West Park

Located in the west of Chengdu, the West Park covers a total area of 36 km². It is 6 km away from the central downtown and 25 km away from the airport. The park is designed to be the R&D and manufacturing base of the three pillar industries of Chengdu Hi-tech Zone, furnished with Export Processing Zone, Bonded Logistic Center, Tools & Moulds Park, Technology Innovation Park, and various standard workshops.

Export Processing Zone: covering a total area of 2.2 km², the first of such in west China operational under the Customs' supervision. Up to now, over 1.5 billion USD has been invested in the Zone. It was rated No.5 among the 56 export processing zones in China. A total import and export value of 4.75 billion USD was achieved in 2008, ranking the first in the central-western region (including north-eastern region). The whole zone is managed in the pattern of "inside the country while outside the customs" and "7 days and 24 hours customs clearance". For each batch of goods, custom clearance is within 2 hours, which is shortened to 20-30 minutes with the paperless clearance system put into use.

Intel, SMIC, Unisem, Molex, MPS and Timken have set up their facilities inside the Zone.

Bonded Logistic Park(Type B): first BLP established in the west, jointly built by the Chengdu Hi-tech Zone and Sinotrans Group. The planned area is 530,000 m², divided into south, north and east blocs. The main functions include port logistics, bonded warehousing, and value-added processing. At 26th of March, 2009, Chengdu Bonded Logistic Park (Type B) was approved by China Customs, Ministry of Finance PRC, State Administration of Taxation and State Administration of Foreign Exchange to operate. It will achieve the "982" Logistics management plan, which guarantees 2 days delivery for 98% goods.

Chengdu Comprehensive Bonded Park: with a planned area of 3.53 km², this park will integrate the function of the current EPZ and Bonded Logistic Park. It will carry out the functions of cargo transfer, delivery, purchase & distribution, transit trade, financial services etc.. Imported goods may enjoy bonded taxation and exported goods may enjoy tax refund.

Tools & Moulds Park: covering a total area of 230mu(15.3 hectares), with a total construction area of 118,000 m², comprising three blocs of tools and moulds, mechanical processing and IT manufacturing. Singapore-based Hi-P, US-based Amphenol have settled down in the Park.

The Technology Innovative Park: covering a total area of 200mu(13.3 hectares), with a construction area of 183,400 m², especially suitable for headquarters, R&D centres, and technological-advanced enterprises. The central research institute of Dongfang Electric, the Technology Centre of Panzhihua Iron & Steel Group and R&D centre of Motorola have settled down in this park.

The National University S&T Park of University of Electronic & Scientific Technology of China: the total construction area is 44,000 m², which is designed to be an intelligence-intensive park dedicated to medium and small sized enterprises.

Optical Electronic Display Park: covering a total area of 3000 mu(200 hectares), the park is suitable for optical-electronic display manufacturers, their suppliers and accessory industries. Enterprises located in this park are: BOE, TSMT and Changhong OLED